As AI Pushes Growth Of Semiconductors, Chip Packaging Gets Competitive
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The world's largest contract chipmaker, Taiwan's TSMC, dominates the most sophisticated advanced packaging technology, including chip-on-wafer-on-substrate, or CoWoS.
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https://www.ndtv.com/world-news/as-ai-pushes-growth-of-semiconductors-chip-packaging-gets-competitive-12292097#publisher=newsstand
